The new lab, Yonhap News Agency reported on Sunday (28 January), citing industry sources, operates under Device Solutions America (DSA), which itself is headquartered in Silicon Valley.
DSA oversees Samsung’s semiconductor production in the US and will work to develop an upgraded DRAM model to help Samsung step up its presence in the global 3D memory chip market.
Samsung is trying to catch up with other chip companies on the market, including its Taiwanese rival TSMC, which recently announced a new factory in the Kumamoto prefecture, Japan, to produce 3nm chips.
TSMC dominates the global semiconductor foundry market, accounting for 56.4% of all chips traded globally.
Last year, Samsung promised to invest €61.9m ($67.11m) in a research and development facility in Hungary, Europe. Located in the city of Göd, the new R&D facility will produce e-motors and later expand into electrified powertrain solutions.
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The new R&D centre in Hungary would create 25 high-skilled jobs, adding to the already more than 6,600 jobs the company has created in the country so far.
In October, the South Korean giant said it was preparing new 3D structures for sub-10nm DRAM, enabling larger single-chip capacities exceeding 100GB.