Taiwan Semiconductor Manufacturing Company (TSMC) is evaluating a potential investment in Texas to expand US chip production, Reuters reported, citing unnamed sources.
The reported investment would be in addition to the $265bn the contract chipmaker has already committed to Arizona.
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The sources said the plans have not been finalised and spoke anonymously because they were not authorised to speak to the media.
TSMC announced a further $100bn investment in Arizona in July, taking its planned commitment there to $265bn.
The increase covers four additional advanced semiconductor manufacturing facilities and lifts the planned US total to 12 leading-edge semiconductor and packaging facilities.
The July announcement followed a March 2025 commitment, when TSMC said it would add $100bn to an original $65bn US investment programme.
TSMC chief executive C C Wei said at the time that “probably additional four or more fabs will be built”, referring to both front-end and back-end facilities.
Chief financial officer Wendell Huang told Reuters in July that the company would continue to invest in the US.
TSMC’s Arizona operations will also include an R&D centre.
In May, TSMC unveiled plans to open a chip design centre in Munich, Germany.
In August, the chipmaker and Sony Semiconductor Solutions Corporation announced the execution of a legally binding definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation, a joint venture in Japan.
The venture is to develop and manufacture smartphone image sensors using advanced process technology, with volume production expected to begin in 2029.
Last month, TSMC published its financial results for August 2026.
On a consolidated basis, net revenue for the month stood at approximately T$514.81bn ($16.13bn), marking a 10.1% increase from July 2026 and a 53.3% rise compared to August 2025.
Across the first eight months of the year, spanning January through August 2026, total revenue reached T$3.38tn, an increase of 39.3% relative to the corresponding period in 2025.
