Semiconductor manufacturer GlobalFoundries (GF) has established an Advanced Facilities Control Centre (AFCC) at its Singapore campus in partnership with technology provider Siemens.
During its first stage, the command hub brings together five separate fabrication-specific control rooms situated across the Singapore campus into one operational base.
The site combines real-time operational figures, tracking systems, and predictive maintenance software to detect equipment irregularities, accelerate root-cause investigations, and rank maintenance tasks by priority.
Autonomous mobile robots fitted with acoustic vibration monitoring, thermal imaging, and gas-detection sensors move through the production areas, sending diagnostic information directly to the hub.
GlobalFoundries chief manufacturing officer Pradip Singh said: “By bringing greater consistency, visibility and intelligence to our critical facilities infrastructure, we are paving the way for smarter, more sustainable operations across our global network and strengthening the foundation that enables GF’s manufacturing excellence.”
Once completely introduced across GF’s wider manufacturing footprint, the system is designed to supervise more than one million critical data points in facilities across the US, Europe, and Asia.
GF stated that consolidating these operations will permit the benchmarking of site metrics, limit unplanned downtime through continuous monitoring, and lower emissions, energy consumption, and redundant infrastructure across its footprint.
The Singapore installation acts as the baseline for the planned introduction of the centralised platform across GF's worldwide manufacturing operations.
Siemens Digital Industries ASEAN managing director Isabel Chong added: “By combining GF’s semiconductor manufacturing expertise with Siemens’ industrial digitalisation capabilities, we are building the next generation of global facilities operations, making semiconductor manufacturing more intelligent, more resilient and more efficient.”
In a separate development in the country last month, Advanced Substrate Technologies, a joint venture between Japan’s Toppan Holdings and US chip producer Broadcom, launched a substrate production site in Singapore.
The business noted that the facility is the country's first with the capacity to manufacture high-end flip-chip ball grid array substrates.
Located in the Jurong Lake District, the site covers roughly 95,000m2 and is designed to meet demand stemming from generative AI and data centres in the region.
